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Sanchez, Loïc
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1

Rarity mediates species‐specific responses of tropical reef..:

Sanchez, Loïc ; Loiseau, Nicolas ; Edgar, Graham J....
Ecology Letters.  27 (2024)  3 - p. , 2024
Link: https://doi.org/10.1111/..
 
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2

Integration And Process Challenges Of Self Assembly Applied..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Bourjot, Emilie ; Bond, Alice ; Nadi, Noura... - p. 1397-1402 , 2023
Link: https://doi.org/10.1109/..
 
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3

Collective Die-to-Wafer Self-Assembly for High Alignment Ac..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Bond, Alice ; Bourjot, Emilie ; Borel, Stephan... - p. 168-176 , 2022
Link: https://doi.org/10.1109/..
 
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4

AlGaInAs Multi-Quantum Well Laser Array on Silicon Achieved..:

, In: 2022 Compound Semiconductor Week (CSW),
Besancon, Claire ; Vaissiere, Nicolas ; Neel, Delphine... - p. 1-2 , 2022
Link: https://doi.org/10.1109/..
 
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5

Benchmarking eleven biodiversity indicators based on enviro..:

Dalongeville, Alicia ; Boulanger, Emilie ; Marques, Virginie...
Journal of Applied Ecology.  59 (2022)  11 - p. 2803-2813 , 2022
Link: https://doi.org/10.1111/..
 
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6

Ecological indicators based on quantitative eDNA metabarcod..:

Sanchez, Loïc ; Boulanger, Emilie ; Arnal, Véronique...
Ecological Indicators.  140 (2022)  - p. 108966 , 2022
Link: https://doi.org/10.1016/..
 
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7

10 μm and 5 μm Die-to-Wafer Direct Hybrid Bonding:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
Bourjot, Emilie ; Bond, Alice ; Ladner, Carine... - p. 31-38 , 2022
Link: https://doi.org/10.1109/..
 
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8

Large‐Diameter III–V on Si Substrates by the Smart Cut Proc..:

Ghyselen, Bruno ; Navone, Christelle ; Martinez, Muriel...
physica status solidi (a).  219 (2022)  4 - p. , 2022
Link: https://doi.org/10.1002/..
 
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9

Large‐Diameter III–V on Si Substrates by the Smart Cut Proc..:

Ghyselen, Bruno ; Navone, Christelle ; Martinez, Muriel...
physica status solidi (a).  219 (2021)  4 - p. , 2021
Link: https://doi.org/10.1002/..
 
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10

SiO2-SiO2 die-to-wafer direct bonding interface weakening:

Tabata, Toshiyuki ; Sanchez, Loic ; Larrey, Vincent..
Microelectronics Reliability.  107 (2020)  - p. 113589 , 2020
Link: https://doi.org/10.1016/..
 
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11

Epitaxial Growth of High‐Quality AlGaInAs‐Based Active Stru..:

Besancon, Claire ; Vaissiere, Nicolas ; Dupré, Cécilia...
physica status solidi (a).  217 (2019)  3 - p. , 2019
Link: https://doi.org/10.1002/..
 
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12

Collective Die Direct Bonding for Photonic on Silicon:

Sanchez, Loic ; Fournel, Frank ; Montmayeul, Brigitte...
ECS Transactions.  86 (2018)  5 - p. 223-231 , 2018
Link: https://doi.org/10.1149/..
 
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13

(Invited) Heterogeneously Integrated III-V on Silicon Laser:

Ben Bakir, Badhise ; Sciancalepore, Corrado ; Descos, Antoine...
ECS Transactions.  64 (2014)  5 - p. 211-223 , 2014
Link: https://doi.org/10.1149/..
 
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14

Capillary self-alignment of polygonal chips: a generalizati..:

Berthier, Jean ; Mermoz, Sébastien ; Brakke, Kenneth...
Microfluidics and Nanofluidics.  14 (2012)  5 - p. 845-858 , 2012
Link: https://doi.org/10.1007/..
 
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15

Challenges and Progress in Germanium-on-Insulator Materials..:

Augendre, Emmanuel ; Sanchez, Loïc ; Benaissa, Lamine...
ECS Transactions.  25 (2009)  7 - p. 351-362 , 2009
Link: https://doi.org/10.1149/..
 
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