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Sandstrom, Cliff
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1

Transcending the Reticle Limit in On-Wafer Die Integration ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Byambadorj, Tsenguun ; Ceballos, Andrew C. ; MacWilliams, Kenneth P.... - p. 11-15 , 2024
Link: https://doi.org/10.1109/..
 
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2

Integrating Chiplets using Chips First Ultra-High-Density F..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Jose, Benedict San ; Sandstrom, Cliff ; Talain, Erick... - p. 271-276 , 2023
Link: https://doi.org/10.1109/..
 
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3

6-Sided Die Protection for Chiplet Package with Multi-Layer..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Kim, Byung-Cheol ; Melgo, Mary Maye ; Gacho, Rizi... - p. 1566-1570 , 2023
Link: https://doi.org/10.1109/..
 
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4

Reducing the Thermal Budget in Low-Temperature Polyimide Di..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Karim, Zia ; Song, Kay ; Sandstrom, Cliff... - p. 551-554 , 2022
Link: https://doi.org/10.1109/..
 
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