Search for persons
X
?
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
1
Transcending the Reticle Limit in On-Wafer Die Integration ..:
, In:
?
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
2
Integrating Chiplets using Chips First Ultra-High-Density F..:
, In:
?
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
3
6-Sided Die Protection for Chiplet Package with Multi-Layer..:
, In:
?
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
4