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Sankarapandian, M.
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1

Wet Etch Recipe Optimization for Enabling RMG Multi Vt Sche..:

, In: 2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Ramirez, Alma Vela ; Sankarapandian, M. ; Bao, Ruqiang... - p. 1-3 , 2024
Link: https://doi.org/10.1109/..
 
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2

Reliable Cu Pillar Undercut Control Using the Endpoint Dete..:

, In: 2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Gardner, Zachary ; Seo, Soon-Cheon ; Khor, Pijeng... - p. 1-3 , 2024
Link: https://doi.org/10.1109/..
 
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3

ScCO2 Drying for Preventing Pattern Collapse in Advanced Lo..:

, In: 2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Sankarapandian, M. ; Lo, Wei-Shang ; Ramirez, Alma Vela... - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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4

Manufacturing Yield Improvement for Advanced CMOS Technolog..:

, In: 2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Fan, S.-C. ; Jamison, P. ; Pancharatnam, S.... - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
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5

A Study to Improve the Vitamin A and Iodine Status of Pregn..:

Vinod Kumar, Malavika ; Sankarapandian, M. ; Erhardt, Juergen.
Journal of Nutrition and Metabolism.  2022 (2022)  - p. 1-9 , 2022
Link: https://doi.org/10.1155/..
 
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6

Hardware Based Performance Assessment of Vertical-Transport..:

, In: 2022 International Electron Devices Meeting (IEDM),
Tsutsui, G. ; Song, S. ; Strane, J.... - p. 34.4.1-34.4.4 , 2022
Link: https://doi.org/10.1109/..
 
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7

Vertical-Transport Nanosheet Technology for CMOS Scaling be..:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Jagannathan, H. ; Anderson, B. ; Sohn, C-W.... - p. 26.1.1-26.1.4 , 2021
Link: https://doi.org/10.1109/..
 
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8

Selective Enablement of Dual Dipoles for Near Bandedge Mult..:

, In: 2020 IEEE Symposium on VLSI Technology,
Bao, R. ; Watanabe, K. ; Zhang, J.... - p. 1-2 , 2020
Link: https://doi.org/10.1109/..
 
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9

Multiple-Vt Solutions in Nanosheet Technology for High Perf..:

, In: 2019 IEEE International Electron Devices Meeting (IEDM),
Bao, R. ; Watanabe, K. ; Zhang, J.... - p. 11.2.1-11.2.4 , 2019
Link: https://doi.org/10.1109/..
 
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10

Full Bottom Dielectric Isolation to Enable Stacked Nanoshee..:

, In: 2019 IEEE International Electron Devices Meeting (IEDM),
Zhang, J. ; Frougier, J. ; Greene, A.... - p. 11.6.1-11.6.4 , 2019
Link: https://doi.org/10.1109/..
 
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11

Preparation and structure of porous dielectrics by plasma e..:

Gates, S. M. ; Neumayer, D. A. ; Sherwood, M. H....
Journal of Applied Physics.  101 (2007)  9 - p. , 2007
Link: https://doi.org/10.1063/..
 
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12

Submicron mapping of strained silicon-on-insulator features..:

Murray, Conal E. ; Sankarapandian, M. ; Polvino, S. M....
Applied Physics Letters.  90 (2007)  17 - p. , 2007
Link: https://doi.org/10.1063/..
 
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13

Novel carbazole phenoxy-based methacrylates to produce high..:

McGrath, James E. ; Rasmussen, Lenore ; Shultz, Albert R....
Polymer.  47 (2006)  11 - p. 4042-4057 , 2006
Link: https://doi.org/10.1016/..
 
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14

Flame retardant novolac–bisphthalonitrile structural thermo..:

Sumner, M.J ; Sankarapandian, M ; McGrath, J.E..
Polymer.  43 (2002)  19 - p. 5069-5076 , 2002
Link: https://doi.org/10.1016/..
 
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15

Miscibility of Poly(arylene phosphine oxide) Systems and Bi..:

Wang, Sheng ; Zhuang, Hong ; Shobha, H. K....
Macromolecules.  34 (2001)  23 - p. 8051-8063 , 2001
Link: https://doi.org/10.1021/..
 
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