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2023 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) ,
2
Thermal Resistivity of FFF Printed Carbon Black Doped Polym..:
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ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC) ,
4
Characterisation of Photodiodes in 22 nm FDSOI at 850 nm:
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2020 IEEE International Reliability Physics Symposium (IRPS) ,
13
Effect of Ambient on the Recovery of Hot-Carrier Degraded D..:
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2020 IEEE 33rd International Conference on Microelectronic Test Structures (ICMTS) ,
14