Scholl, Jon
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1

An Assessment of Sample Preparation Challenges in 3D Stacke..:

, In: 2023 IEEE Physical Assurance and Inspection of Electronics (PAINE),
Padro, Noah ; Patel, Yash ; Scholl, Jon... - p. 1-7 , 2023
 
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2

A Decomposition Workflow for Integrated Circuit Verificatio..:

Kimura, Adam ; Scholl, Jon ; Schaffranek, James...
Journal of Hardware and Systems Security.  4 (2020)  1 - p. 34-43 , 2020
 
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3

From Silicon to Simulation: A Full Decomposition of a Fabri..:

, In: 2020 IEEE Physical Assurance and Inspection of Electronics (PAINE),
Kimura, Adam G. ; Waite, Adam R. ; Scholl, Jon... - p. 1-6 , 2020
 
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4

Preparation, Imaging, and Design Extraction of the Front-En..:

Adam R. Waite (11285445) ; Yash Patel (11286005) ; John Kelley (11286018)...
https://figshare.com/articles/preprint/Preparation_Imaging_and_Design_Extraction_of_the_Front-End-of-Line_and_Middle-of-Line_in_a_14_nm_Node_FinFET_Device/15182256.  , 2021
 
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5

Contributors:

, In: Rivers of Europe,
Aamodt, Knut Ola ; Agnija, Skuja ; Agrita, Briede... - p. xi-xv , 2022
 
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6

Dynamic stenosis of the right main bronchus in a 3-month-ol..:

Scholl, Heiko ; Lutz, Jon A ; Kadner, Alexander.
European Journal of Cardio-Thoracic Surgery.  55 (2018)  3 - p. 579-581 , 2018
 
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