Schrag, Gabriele
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1

Design Optimization of a Corrugated Piezoelectric MEMS Micr..:

, In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
 
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3

Electrohydrodynamic Printing of Conductive Microstrips on H..:

, In: 2024 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS),
 
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5

Predictive Modelling of Emitter Systems in Photoacoustic Ga..:

, In: 2023 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP),
 
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6

Fully-Coupled Transient Modeling of Highly Miniaturized Ele..:

, In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
 
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7

Electric Vehicle Thermal Management System Modeling with In..:

, In: 2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe),
 
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9

Humidity Sensing for free—advanced thermoacoustic signal mo..:

, In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
 
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10

High-Throughput Apparatus for Semiconductor Device Characte..:

Okeil, Hesham ; Schrag, Gabriele ; Wachutka, Gerhard
IEEE Transactions on Instrumentation and Measurement.  72 (2023)  - p. 1-8 , 2023
 
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14

Humidity and corrosion susceptibility of molded packages un..:

, In: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
 
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