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Schuddinck, Pieter
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1

DTCO of Nanosheet and Forksheet Architectures: Exploring Di..:

, In: 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
Gaddemane, Gautam ; Schuddinck, Pieter ; Bhuwalka, Krishna... - p. 1-3 , 2024
Link: https://doi.org/10.1109/..
 
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2

Multi-VT Options at Scaled Vertical Pitch in Gate-All-Aroun..:

, In: 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
Gaddemane, Gautam ; Bhuwalka, Krishna ; Rzepa, Gerhard... - p. 1-3 , 2024
Link: https://doi.org/10.1109/..
 
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3

Future Design Direction for SRAM Data Array: Hierarchical S..:

Liu, Hsiao-Hsuan ; Gilardi, Carlo ; Salahuddin, Shairfe M....
IEEE Transactions on Circuits and Systems I: Regular Papers.  , 2024
Link: https://doi.org/10.1109/..
 
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4

CFET SRAM With Double-Sided Interconnect Design and DTCO Be..:

Liu, Hsiao-Hsuan ; Schuddinck, Pieter ; Pei, Zhenlin...
IEEE Transactions on Electron Devices.  70 (2023)  10 - p. 5099-5106 , 2023
Link: https://doi.org/10.1109/..
 
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5

CFET SRAM DTCO, Interconnect Guideline, and Benchmark for C..:

Liu, Hsiao-Hsuan ; Salahuddin, Shairfe M. ; Chan, Boon Teik...
IEEE Transactions on Electron Devices.  70 (2023)  3 - p. 883-890 , 2023
Link: https://doi.org/10.1109/..
 
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6

Evaluation of BEOL scaling boosters for sub-2nm using enhan..:

, In: 2022 IEEE International Interconnect Technology Conference (IITC),
Farokhnejad, Anita ; Esposto, Simone ; Ciofi, Ivan... - p. 136-138 , 2022
Link: https://doi.org/10.1109/..
 
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7

Backside PDN and 2.5D MIMCAP to Double Boost 2D and 3D ICs ..:

Chen, Rongmei ; Sisto, Giuliano ; Stucchi, Michele...
uri/info:doi/10.1109/VLSITechnologyandCir46769.2022.9830328.  , 2022
Link: http://hdl.handle.net/20..
 
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