Sekaran, Sreetharan
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1

Reliability Studies of Novel Au-coated Ag (ACA) Bonding Wir..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
 
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2

Analysis of leadframe discoloration on rough pre-plated fra..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
 
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3

Reliability of Ag bonding wires and its coated variants fro..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
 
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