Seo, Seong Min
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1

Eutectic Bonding in Sequential Bi and Sn Layers for Low-Tem..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
 
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3

Ultrasonic dispersion of nanocomposite solder for microelec..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
 
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5

Three-Dimesnional Semicondoctor Stacking using TSV(Through-..:

Cho, Do Hoon ; Kang, Hye Jun ; Seo, Seong Min...
Journal of Welding and Joining.  39 (2021)  3 - p. 295-303 , 2021
 
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11

Featured Cover:

Lee, Yoon Seon ; Park, Yeoung‐Hyun ; Hwang, Geumbit...
Aging Cell.  23 (2024)  3 - p. , 2024
 
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12

Low-temperature rapid UV sintering of sputtered TiO2 for fl..:

Yoo, Yongseok ; Seo, Gabseok ; Park, Hee Jeong...
Journal of Materials Chemistry A.  12 (2024)  3 - p. 1562-1572 , 2024
 
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