Sethi, K.
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3

Intel PowerVia Technology: Backside Power Delivery for High..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Hafez, W. ; Agnihotri, P. ; Asoro, M.... - p. 1-2 , 2023
 
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6

Microstructure and tribological properties of Co-Ni alloys ..:

Sethi, A.K.
Materials Today: Proceedings.  43 (2021)  - p. 413-416 , 2021
 
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7

The Future of Hardware Technologies for Computing: N3XT 3D ..:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Radway, R.M. ; Sethi, K. ; Chen, W.-C.... - p. 25.4.1-25.4.4 , 2021
 
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Design Optimization of Double-Stage Thermoelectric Refriger..:

, In: Proceedings of International Conference in Mechanical and Energy Technology; Smart Innovation, Systems and Technologies,
 
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9

Thermal Modeling and Analysis of Double-Slope Solar Still:

, In: Proceedings of International Conference in Mechanical and Energy Technology; Smart Innovation, Systems and Technologies,
Sethi, A. K. ; Dwivedi, V. K. ; Sharma, Sudhanshu. - p. 665-674 , 2020
 
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10

A Reliability Overview of Intel's 10+ Logic Technology:

, In: 2020 IEEE International Reliability Physics Symposium (IRPS),
Grover, R. ; Acosta, T. ; AnDyke, C.... - p. 1-6 , 2020
 
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Reliability Characteristics of a High Density Metal- Insula..:

, In: 2020 IEEE International Reliability Physics Symposium (IRPS),
Lin, C.-Y. ; Avci, U. E. ; Blount, M. A.... - p. 1-4 , 2020
 
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12

Studies on hard surfacing of structural steel by gas therma..:

Sethi, A.K.
Materials Today: Proceedings.  21 (2020)  - p. 1436-1440 , 2020
 
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13

Tilted Bianchi-I Cosmological Model with Perfect Fluid in L..:

Patra, R. N. ; Sethi, A. K.
International Journal of Applied and Computational Mathematics.  5 (2019)  3 - p. , 2019
 
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