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Shafahian, Ehsan
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1

Chemical mechanical polishing for indium bond pad damascene..:

Ceulemans, Karl ; Shafahian, Ehsan ; Struyf, Herbert...
Japanese Journal of Applied Physics.  63 (2024)  3 - p. 03SP39 , 2024
Link: https://doi.org/10.35848..
 
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2

3D interconnects for quantum computing:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Derakhshandeh, Jaber ; Dangol, Anish ; Hussain, Tassawar... - p. 821-828 , 2024
Link: https://doi.org/10.1109/..
 
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3

Plasma Cleaning and Thermal Compression Bonding of Indium B..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Kang, Kumin ; Derakhshandeh, Jaber ; Wendeln, Christian... - p. 267-268 , 2024
Link: https://doi.org/10.23919..
 
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4

Low temperature backside damascene processing on temporary ..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Derakhshandeh, Jaber ; Beyne, Eric ; Beyer, Gerald... - p. 1108-1113 , 2022
Link: https://doi.org/10.1109/..
 
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5

Confined IMCs for low temperature and high throughput D2W b..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Derakhshandeh, Jaber ; La Tulipe, Douglas Charles ; Capuz, Giovanni... - p. 131-132 , 2022
Link: https://doi.org/10.23919..
 
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6

Fundamental study of IMC grains at low anneal temperature:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Gerets, Carine ; Derakhshandeh, Jaber ; Shafahian, Ehsan... - p. 133-134 , 2022
Link: https://doi.org/10.23919..
 
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7

10 and 7 μm Pitch Thermo-compression Solder Joint, Using A ..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Derakhshandeh, Jaber ; Capuz, Giovanni ; Cherman, Vladimir... - p. 617-622 , 2020
Link: https://doi.org/10.1109/..
 
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8

Electrodeposition of bismuth telluride thin films containin..:

Wu, Minxian ; Ramírez, Salvador Alvarado ; Shafahian, Ehsan...
Electrochimica Acta.  253 (2017)  - p. 554-562 , 2017
Link: https://doi.org/10.1016/..
 
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