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2020 IEEE 6th World Forum on Internet of Things (WF-IoT) ,
2
Multi-Dimensional Integration and Packaging of Devices for ..:
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2020 3rd IEEE International Conference on Soft Robotics (RoboSoft) ,
5
Low-cost foil/paper based touch mode pressure sensing eleme..:
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2019 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) ,
7