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2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
8
High Q-Factor 3D Tall Copper Pillar Inductor on a Wafer-Lev..:
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2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
9
RF Devices Integrated by Fan-Out and System-In-Package Tech..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
12