E-LIB Suche - Ergebnisse für: Shen, Yu-An

1

Improvement of Solder Joint Shear Strength under Formic Aci..:

He, Siliang ; Jiang, Jian ; Shen, Yu-An...
Materials. 17 (2024) 5 - p. 1055 , 2024

Link: https://doi.org/10.3390/..

2

Dissolution Behavior of Cu-2.0 wt.% Be (Alloy 25) and Cu-0...:

Laksono, Andromeda Dwi ; Shen, Yu-An ; Chen, Ting.
JOM. 76 (2024) 6 - p. 2754-2762 , 2024

Link: https://doi.org/10.1007/..

3

Exploring mechanism of suppressing void formation at Interf..:

Shen, Yu-An ; Lin, Chan-Ying ; Chen, Chih-Ming
Journal of Materials Science: Materials in Electronics. 35 (2024) 11 - p. , 2024

Link: https://doi.org/10.1007/..

4

Effect of indium addition on mechanical, thermal, and solde..:

Shen, Yu-An
Materials Chemistry and Physics. 315 (2024) - p. 128992 , 2024

Link: https://doi.org/10.1016/..

5

Thermomigration suppression in Sn3.5Ag solder joints by hot..:

Shen, Yu-An ; Lin, Yun-Xuan ; Ouyang, Fan-Yi..
Intermetallics. 154 (2023) - p. 107821 , 2023

Link: https://doi.org/10.1016/..

6

Void-free interface between In and high-impurity Cu joint:

Lee, Jia-Yi ; Shen, Yu-An ; Chen, Chih-Ming
Science and Technology of Welding and Joining. 28 (2023) 9 - p. 983-991 , 2023

Link: https://doi.org/10.1080/..

7

Bi Dispersion Hardening in Sn-Bi Alloys by Solid-State Agin:

Shen, Yu-An
JOM. , 2023

Link: https://doi.org/10.1007/..

8

Low-Temperature Transient Liquid Phase Bonding Technology v..:

He, Siliang ; Xiong, Bifu ; Xu, Fangyi...
Materials. 16 (2023) 6 - p. 2389 , 2023

Link: https://doi.org/10.3390/..

9

Significant Hall–Petch effect in micro-nanocrystalline elec..:

Kao, Yu-Jyun ; Li, Yu-Ju ; Shen, Yu-An.
Scientific Reports. 13 (2023) 1 - p. , 2023

Link: https://doi.org/10.1038/..

10

Contact angle analysis and intermetallic compounds formatio..:

He, Siliang ; Bi, Yuhao ; Shen, Yu-An...
Journal of Advanced Joining Processes. 6 (2022) - p. 100118 , 2022

Link: https://doi.org/10.1016/..

11

Effect of Sn Grain Orientation on Reliability Issues of Sn-..:

Shen, Yu-An ; Wu, John A.
Materials. 15 (2022) 14 - p. 5086 , 2022

Link: https://doi.org/10.3390/..

12

A Study on Strengthening Mechanisms in Sn-0.7Cu via Microst..:

, In: 2022 International Conference on Electronics Packaging (ICEP),

Shen, Yu-An ; Ouyang, Yu-Hong - p. 41-42 , 2022

Link: https://doi.org/10.23919..

13

Effect of Cu on the interfacial reaction between Sn-based s..:

Shen, Yu-An ; Yang, Xiu-Mei ; Tsai, Cheng-Yu...
Intermetallics. 144 (2022) - p. 107530 , 2022

Link: https://doi.org/10.1016/..

14

Graphene as a diffusion barrier at the interface of Liquid–..:

Shen, Yu-An ; Chen, Hao-Zhe ; Chen, Sheng-Wen...
Applied Surface Science. 578 (2022) - p. 152108 , 2022

Link: https://doi.org/10.1016/..

15

Behavior of Sn-3.0Ag-0.5Cu solder/Cu fluxless soldering via..:

He, Siliang ; Shen, Yu-An ; Xiong, Bifu...
Journal of Materials Research and Technology. 21 (2022) - p. 2352-2361 , 2022

Link: https://doi.org/10.1016/..