Sheng, Kuang
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1

Dynamic On-Resistance Characterization of GaN Power HEMTs U..:

Xie, Zonglun ; Wu, Xinke ; Dong, Zezheng...
IEEE Transactions on Power Electronics.  39 (2024)  2 - p. 1963-1967 , 2024
 
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2

Design and Experimental Demonstration of 4H-SiC Lateral Hig..:

Liu, Li ; Guo, Qing ; Wang, Jue...
IEEE Transactions on Electron Devices.  71 (2024)  3 - p. 1572-1579 , 2024
 
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A numerical investigation of the thermal–hydraulic performa..:

Tang, Weiyu ; Li, Junye ; Wu, Zan..
Applied Thermal Engineering.  236 (2024)  - p. 121820 , 2024
 
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7

Investigation of Z-type manifold microchannel cooling for u..:

Yang, Shudong ; Li, Junye ; Cao, Biqi..
International Journal of Heat and Mass Transfer.  218 (2024)  - p. 124792 , 2024
 
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9

Numerical Simulation and Analytical Modeling of Multichanne..:

He, Quanbo ; Wang, Hengyu ; Xiao, Ming...
IEEE Transactions on Electron Devices.  71 (2024)  3 - p. 1710-1717 , 2024
 
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10

Post-trench restoration for vertical GaN power devices:

Li, Yanjun ; Ren, Na ; Wang, Hengyu...
Applied Physics Letters.  124 (2024)  9 - p. , 2024
 
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14

Comparative study for waste heat recovery in immersion cool..:

Zhou, Xia ; Xin, Zhicheng ; Tang, Weiyu..
Applied Thermal Engineering.  242 (2024)  - p. 122479 , 2024
 
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15

Numerical study on a new manifold ring-shaped microchannel ..:

Xin, Zhicheng ; Tang, Weiyu ; Wu, Zan...
International Journal of Thermal Sciences.  204 (2024)  - p. 109225 , 2024
 
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