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Shi, Bobi
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1

Modeling and Analysis of Heterogeneously Integrated Chiplet..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Sun, Haofeng ; Shi, Bobi ; Nguyen, Thong. - p. 1078-1084 , 2024
Link: https://doi.org/10.1109/..
 
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2

Signal and Power Integrity Co-Simulation of Chiplet-to-Chip..:

, In: 2024 IEEE 28th Workshop on Signal and Power Integrity (SPI),
Zhou, Yi ; Shi, Bobi ; Nguyen, Thong.. - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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3

Minimum Cursors Selection in Statistical Method for Eye Dia..:

, In: 2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS),
Shi, Bobi ; Schutt-Aine, Jose E. - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
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4

Fast Latency-Insertion-Method-Based Eye Diagram Simulation ..:

, In: 2023 IEEE 27th Workshop on Signal and Power Integrity (SPI),
Zhou, Yi ; Shi, Bobi ; Schutt-Aine, Jose E. - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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5

Constrained Gaussian Process for Signal Integrity applicati..:

, In: 2023 IEEE/MTT-S International Microwave Symposium - IMS 2023,
Nguyen, Thong ; Shi, Bobi ; Ma, Hanzhi... - p. 155-158 , 2023
Link: https://doi.org/10.1109/..
 
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6

Statistical Method for Eye Diagram Simulation in a High-Spe..:

, In: 2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS),
Shi, Bobi ; Zhou, Yi ; Nguyen, Thong. - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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7

Channel Inverse Design Using Tandem Neural Network:

, In: 2022 IEEE 26th Workshop on Signal and Power Integrity (SPI),
Ma, Hanzhi ; Li, Er-Ping ; Wang, Yuechen... - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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8

Fast Eye Diagram Simulation based on Latency Insertion Meth..:

, In: 2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS),
Zhou, Yi ; Shi, Bobi ; Zhao, Yixuan. - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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9

Comparative Study of Surrogate Modeling Methods for Signal ..:

Nguyen, Thong ; Shi, Bobi ; Ma, Hanzhi...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  11 (2021)  9 - p. 1369-1379 , 2021
Link: https://doi.org/10.1109/..
 
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10

Variational Inference approach to Jitter decomposition in H..:

, In: 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS),
Shi, Bobi ; Nguyen, Thong ; Schutt-Aine, Jose - p. 1-3 , 2020
Link: https://doi.org/10.1109/..
 
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