E-LIB Suche - Ergebnisse für: Shie, Chuen-Kai

1

Representation Learning on Large and Small Data:

, In: Big Data Analytics for Large-Scale Multimedia Search,

Chou, Chun-Nan ; Shie, Chuen-Kai ; Chang, Fu-Chieh.. - p. 1-28 , 2019

Link: https://doi.org/10.1002/..

2

Freehand Push-Gesture Recognition via 3D Palm Trajectory Mo..:

, In: Proceedings of the Third International Symposium of Chinese CHI,

Lin, Shih-Yao ; Shie, Chuen-Kai ; Chen, Chu-Song. - p. 37-41 , 2015

Link: https://dl.acm.org/doi/1..

3

AirTouch panel : a re-anchorable virtual touch panel:

, In: Proceedings of the 21st ACM international conference on Multimedia,

Lin, Shih-Yao ; Shie, Chuen-Kai ; Chen, Shen-Chi. - p. 625-628 , 2013

Link: https://dl.acm.org/doi/1..

4

Action recognition for human-marionette interaction:

, In: Proceedings of the 20th ACM international conference on Multimedia,

Lin, Shih-Yao ; Shie, Chuen-Kai ; Chen, Shen-Chi. - p. 39-48 , 2012

Link: https://dl.acm.org/doi/1..

5

Representation Learning on Large and Small Data:

Chou, Chun-Nan ; Shie, Chuen-Kai ; Chang, Fu-Chieh..
http://arxiv.org/abs/1707.09873. , 2017

Link: http://arxiv.org/abs/170..

6

Identification of the Alternative Splice Products Encoded b..:

Liu, Hsin-tzu ; Lin, Ta-hsien ; Kuo, Hann-chorng...
Biochemical and Biophysical Research Communications. 291 (2002) 5 - p. 1293-1296 , 2002

Link: https://doi.org/10.1006/..

7

Stress Relaxation and Grain Growth Behaviors of (111)-Prefe..:

Lai, Jyun-Yu ; Tran, Dinh-Phuc ; Yang, Shih-Chi...
Nanomaterials. 13 (2023) 4 - p. 709 , 2023

Link: https://doi.org/10.3390/..

8

Low Contact Resistance and Low Temperature Hybrid Bonding w..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),

He, Pin-Syuan ; Shie, Kai-Cheng ; Chen, Chih - p. 321-323 , 2023

Link: https://doi.org/10.1109/..

9

High-Bonding-Strength Polyimide Films Achieved via Thermal ..:

He, Pin-Syuan ; Tran, Dinh-Phuc ; Kuo, Ting-Yu...
Nanomaterials. 13 (2023) 9 - p. 1575 , 2023

Link: https://doi.org/10.3390/..

10

Artificial intelligence deep learning for 3D IC reliability..:

Hsu, Po-Ning ; Shie, Kai-Cheng ; Chen, Kuan-Peng...
Scientific Reports. 12 (2022) 1 - p. , 2022

Link: https://doi.org/10.1038/..

11

Failures of Cu-Cu Joints under Temperature Cycling Tests:

Hsu, Po-Ning ; Shie, Kai-Cheng ; Tran, Dinh-Phuc..
Materials. 15 (2022) 14 - p. 4944 , 2022

Link: https://doi.org/10.3390/..

12

Enhancement of fatigue resistance by recrystallization and ..:

Ong, Jia-Juen ; Tran, Dinh-Phuc ; Lan, Man-Chi...
Scientific Reports. 12 (2022) 1 - p. , 2022

Link: https://doi.org/10.1038/..

13

Effect of Tin Grain Orientation on Electromigration-Induced..:

Hsu, Po-Ning ; Lee, Dai-Lung ; Tran, Dinh-Phuc...
Materials. 15 (2022) 20 - p. 7115 , 2022

Link: https://doi.org/10.3390/..

14

Low-Temperature Cu/SiO2 Hybrid Bonding with Low Contact Res..:

Ong, Jia-Juen ; Chiu, Wei-Lan ; Lee, Ou-Hsiang...
Materials. 15 (2022) 5 - p. 1888 , 2022

Link: https://doi.org/10.3390/..

15

Non-destructive micro analysis of electromigration failures..:

Tran, Dinh-Phuc ; Lin, Tzu-Wen ; Shie, Kai-Cheng.
Materials Characterization. 194 (2022) - p. 112404 , 2022

Link: https://doi.org/10.1016/..