E-LIB Suche - Ergebnisse für: Shie, Kai-Cheng

1

Chemical mechanical planarization of nanotwinned copper/pol..:

He, Pin-Syuan ; Tu, Chun-Wei ; Shie, Kai-Cheng...
Journal of Electroanalytical Chemistry. 969 (2024) - p. 118544 , 2024

Link: https://doi.org/10.1016/..

2

Low Contact Resistance and Low Temperature Hybrid Bonding w..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),

He, Pin-Syuan ; Shie, Kai-Cheng ; Chen, Chih - p. 321-323 , 2023

Link: https://doi.org/10.1109/..

3

High-Bonding-Strength Polyimide Films Achieved via Thermal ..:

He, Pin-Syuan ; Tran, Dinh-Phuc ; Kuo, Ting-Yu...
Nanomaterials. 13 (2023) 9 - p. 1575 , 2023

Link: https://doi.org/10.3390/..

4

Stress Relaxation and Grain Growth Behaviors of (111)-Prefe..:

Lai, Jyun-Yu ; Tran, Dinh-Phuc ; Yang, Shih-Chi...
Nanomaterials. 13 (2023) 4 - p. 709 , 2023

Link: https://doi.org/10.3390/..

5

Failures of Cu-Cu Joints under Temperature Cycling Tests:

Hsu, Po-Ning ; Shie, Kai-Cheng ; Tran, Dinh-Phuc..
Materials. 15 (2022) 14 - p. 4944 , 2022

Link: https://doi.org/10.3390/..

6

Effect of Tin Grain Orientation on Electromigration-Induced..:

Hsu, Po-Ning ; Lee, Dai-Lung ; Tran, Dinh-Phuc...
Materials. 15 (2022) 20 - p. 7115 , 2022

Link: https://doi.org/10.3390/..

7

Enhancement of fatigue resistance by recrystallization and ..:

Ong, Jia-Juen ; Tran, Dinh-Phuc ; Lan, Man-Chi...
Scientific Reports. 12 (2022) 1 - p. , 2022

Link: https://doi.org/10.1038/..

8

Artificial intelligence deep learning for 3D IC reliability..:

Hsu, Po-Ning ; Shie, Kai-Cheng ; Chen, Kuan-Peng...
Scientific Reports. 12 (2022) 1 - p. , 2022

Link: https://doi.org/10.1038/..

9

Modeling of Cu-Cu Thermal Compression Bonding:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),

Shie, Kai-Cheng ; Tran, Dinh-Phuc ; Gusak, A. M.... - p. 2201-2205 , 2022

Link: https://doi.org/10.1109/..

10

Low-Temperature Cu/SiO2 Hybrid Bonding with Low Contact Res..:

Ong, Jia-Juen ; Chiu, Wei-Lan ; Lee, Ou-Hsiang...
Materials. 15 (2022) 5 - p. 1888 , 2022

Link: https://doi.org/10.3390/..

11

Non-destructive micro analysis of electromigration failures..:

Tran, Dinh-Phuc ; Lin, Tzu-Wen ; Shie, Kai-Cheng.
Materials Characterization. 194 (2022) - p. 112404 , 2022

Link: https://doi.org/10.1016/..

12

A kinetic model of copper-to-copper direct bonding under th..:

Shie, Kai-Cheng ; Gusak, A.M. ; Tu, K.N..
Journal of Materials Research and Technology. 15 (2021) - p. 2332-2344 , 2021

Link: https://doi.org/10.1016/..

13

Failure Mechanisms of Cu–Cu Bumps under Thermal Cycling:

Shie, Kai-Cheng ; Hsu, Po-Ning ; Li, Yu-Jin..
Materials. 14 (2021) 19 - p. 5522 , 2021

Link: https://doi.org/10.3390/..

14

Shearing Characteristics of Cu-Cu Joints Fabricated by Two-..:

Ong, Jia-Juen ; Tran, Dinh-Phuc ; Yang, Shih-Chi..
Metals. 11 (2021) 11 - p. 1864 , 2021

Link: https://doi.org/10.3390/..

15

Effect of Bonding Strength on Electromigration Failure in C..:

Shie, Kai-Cheng ; Hsu, Po-Ning ; Li, Yu-Jin..
Materials. 14 (2021) 21 - p. 6394 , 2021

Link: https://doi.org/10.3390/..