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Shih, Chih-Hsin
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1

Liquid chromatography on a centrifugal platform for separat..:

Shih, Chih-Hsin ; Ke, Chao-Hui ; Hsiao, Chih-Chien
Journal of Chromatography A.  1705 (2023)  - p. 464211 , 2023
Link: https://doi.org/10.1016/..
 
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2

Sequential flow control by liquid decanting on a centrifuga..:

Shih, Chih-Hsin ; Cheng, Yuan-Ting ; Wu, Ho-Chin..
Sensors and Actuators A: Physical.  347 (2022)  - p. 113957 , 2022
Link: https://doi.org/10.1016/..
 
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3

Automated Protein Purification on a Centrifugal Platform:

Shih, Chih-Hsin ; Chen, Jin-Ping ; Zhao, Yi-Xiang
ECS Journal of Solid State Science and Technology.  9 (2020)  11 - p. 115007 , 2020
Link: https://doi.org/10.1149/..
 
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4

Insight into Mechanisms of Cellular Uptake of Lipid Nanopar..:

Yu, Bo ; Wang, Xinmei ; Zhou, Chenguang...
Pharmaceutical Research.  31 (2014)  10 - p. 2685-2695 , 2014
Link: https://doi.org/10.1007/..
 
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5

Preparation and characterization of ultra-thin amphiphobic ..:

Mou, Chun-Yueh ; Yuan, Wei-Li ; Shih, Chih-Hsin
Thin Solid Films.  537 (2013)  - p. 202-207 , 2013
Link: https://doi.org/10.1016/..
 
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6

Prothrombin time tests on a microfluidic disc analyzer:

Shih, Chih-Hsin ; Lu, Chien-Hsing ; Wu, Jia-Huei...
Sensors and Actuators B: Chemical.  161 (2012)  1 - p. 1184-1190 , 2012
Link: https://doi.org/10.1016/..
 
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7

Pyogenic Liver Abscess with Prevotella Species and Fusobact..:

Lei, Wei-Yi ; Chang, Wen-Hsiung ; Shih, Shou-Chuan..
Journal of the Formosan Medical Association.  108 (2009)  3 - p. 253-257 , 2009
Link: https://doi.org/10.1016/..
 
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8

Tackification of Textile Fiber Preforms in Resin Transfer M..:

Shih, Chih-Hsin ; Lee, L. James
Journal of Composite Materials.  35 (2001)  21 - p. 1954-1981 , 2001
Link: https://doi.org/10.1177/..
 
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9

High Acceleration Dynamic Methodology for Board-Level Shock..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Yu, Min-Cheng ; Wu, Nan-Yi ; Wang, Wu-Lung... - p. 1213-1218 , 2024
Link: https://doi.org/10.1109/..
 
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10

Semiconductor Fan-Out Polymer Adhesion on Physical Vapor De..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Lin, Nien-Chun ; Shih, Hsin-Chih ; Tsai, Ching-I... - p. 179-180 , 2024
Link: https://doi.org/10.23919..
 
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11

Die Bonding Solution for Flip Chip-Chip Scale Package-DIC (..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Liao, Po Yu ; Ho, Ian ; Lai, David... - p. 182-186 , 2022
Link: https://doi.org/10.1109/..
 
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12

Package on System Level Solder Joint Stress Analysis Under ..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Shih, Hsin-Chih ; Liao, HowardTW ; Chen, Ryan... - p. 1509-1516 , 2020
Link: https://doi.org/10.1109/..
 
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13

An Experimental Investigation Into Thin Silicon Die Strengt..:

, In: 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Shih, Hsin-Chih ; Tsai, Fila ; Shih, Meng-Kai.. - p. 187-190 , 2019
Link: https://doi.org/10.1109/..
 
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14

Molecular separation by using active and passive microfluid..:

Ebrahimi, Aliakbar ; İçöz, Kutay ; Didarian, Reza...
Advanced Materials Interfaces.  , 2023
Link: https://hdl.handle.net/1..
 
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15

The centrifugal viscometer:

Shih, Chih-Hsin ; Chang, Chia-Chin ; Liu, Chung-Yi.
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC8412967/.  , 2021
Link: http://www.ncbi.nlm.nih...
 
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