E-LIB Suche - Ergebnisse für: Shih, Po-Cheng

1

Risk of psoriatic arthritis development with interleukin-17..:

Shih, Po-Cheng ; Huo, An-Ping ; Leong, Pui-Ying.
European Journal of Internal Medicine. , 2024

Link: https://doi.org/10.1016/..

2

Letter to the editor regarding "The phenotype of mixed conn..:

Shih, Po-Cheng
Seminars in Arthritis and Rheumatism. 64 (2024) - p. 152332 , 2024

Link: https://doi.org/10.1016/..

3

Response to Hasan et al.'s "Dupilumab therapy for atopic de..:

Shih, Po-Cheng ; Wei, James Cheng Chung
Journal of the American Academy of Dermatology. , 2024

Link: https://doi.org/10.1016/..

4

Comment on: Impact of interstitial lung disease on clinical..:

Shih, Po-Cheng
Rheumatology. , 2023

Link: https://doi.org/10.1093/..

5

Using personalized next session to improve session-based re..:

Chen, Yen-Liang ; Wu, Chia-Chi ; Shih, Po-Cheng
The Journal of Supercomputing. 80 (2023) 6 - p. 7369-7398 , 2023

Link: https://doi.org/10.1007/..

6

Letter to the Editor regarding "COVID-19 outcomes in patien..:

Lin, Wen-Jiun ; Shih, Po-Cheng ; Wei, James Cheng-Chung
Seminars in Arthritis and Rheumatism. 60 (2023) - p. 152181 , 2023

Link: https://doi.org/10.1016/..

7

Recent targets of osteoarthritis research:

Shih, Po-Cheng ; Lee, Yung-Heng ; Tsou, Hsi-Kai.
Best Practice & Research Clinical Rheumatology. 37 (2023) 2 - p. 101851 , 2023

Link: https://doi.org/10.1016/..

8

IMC formation on BGA package with Sn–Ag–Cu and Sn–Ag–Cu–Ni–..:

Lin, Kwang-Lung ; Shih, Po-Cheng
Journal of Alloys and Compounds. 452 (2008) 2 - p. 291-297 , 2008

Link: https://doi.org/10.1016/..

9

Electrical resistance of Sn–Ag–Cu ball grid array packages ..:

Shih, Po-Cheng ; Lin, Kwang-Lung
Journal of Materials Research. 22 (2007) 1 - p. 113-123 , 2007

Link: https://doi.org/10.1557/..

10

Spallation of interfacial Ag–Au–Cu–Zn compounds in Sn–Ag–Cu..:

Shih, Po-Cheng ; Lin, Kwang-Lung
Journal of Alloys and Compounds. 439 (2007) 1-2 - p. 137-142 , 2007

Link: https://doi.org/10.1016/..

11

Correlation between interfacial microstructure and shear be..:

Shih, Po-Cheng ; Lin, Kwang-Lung
Journal of Materials Science. 42 (2007) 8 - p. 2574-2581 , 2007

Link: https://doi.org/10.1007/..

12

Interfacial microstructure and shear behavior of Sn–Ag–Cu s..:

Shih, Po-Cheng ; Lin, Kwang-Lung
Journal of Alloys and Compounds. 422 (2006) 1-2 - p. 153-163 , 2006

Link: https://doi.org/10.1016/..

13

Interfacial Bonding Behavior with Introduction of Sn–Zn–Bi ..:

Shih, Po-Cheng ; Lin, Kwang-Lung
Journal of Materials Research. 20 (2005) 1 - p. 219-229 , 2005

Link: https://doi.org/10.1557/..

14

Effect of microstructural evolution on electrical property ..:

Shih, Po-Cheng ; Lin, Kwang-Lung
Journal of Materials Research. 20 (2005) 10 - p. 2854-2865 , 2005

Link: https://doi.org/10.1557/..

15

Mechanical strength of Sn-3.5Ag-based solders and related b..:

Chuang, Chiang-Ming ; Shih, Po-Cheng ; Lin, Kwang-Lung
Journal of Electronic Materials. 33 (2004) 1 - p. 1-6 , 2004

Link: https://doi.org/10.1007/..