Shirley, Dwayne R.
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1

2.5D Silicon Photonics Interposer Flip Chip Attach:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
 
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2

Effects of Wiring Density and Pillar Structure on Chip Pack..:

, In: 2020 IEEE International Reliability Physics Symposium (IRPS),
 
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5

List of Contributors:

, In: Veterinary Toxicology,
 
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6

List of Contributors:

, In: Veterinary Toxicology,
 
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11

Understanding Pesticide Exposure Mitigation Effectiveness i..:

Teed, R. Scott ; Winchell, Michael ; Moore, Dwayne R. J....
ACS Agricultural Science & Technology.  4 (2024)  5 - p. 554-566 , 2024
 
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12

Using emerging science to inform risk characterizations for..:

Johnson, Mark S. ; Beking, Michael ; Verbruggen, Eric M. J....
Integrated Environmental Assessment and Management.  20 (2024)  3 - p. 765-779 , 2024
 
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