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Shishido, Nobuyuki
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1

Power-cycling degradation monitoring of an IGBT module with..:

Hasegawa, Kazunori ; Hara, Kanta ; Shishido, Nobuyuki...
Power Electronic Devices and Components.  7 (2024)  - p. 100061 , 2024
Link: https://doi.org/10.1016/..
 
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2

Fracture and Embedment Behavior of Brittle Submicrometer Sp..:

Nakamura, Daizen ; Koshizaki, Naoto ; Shishido, Nobuyuki..
Nanomaterials.  11 (2021)  9 - p. 2201 , 2021
Link: https://doi.org/10.3390/..
 
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3

Methodology for calculating J-integral range ΔJ under cycli..:

Hagihara, Seiya ; Shishido, Nobuyuki ; Hayama, Yutaka.
International Journal of Pressure Vessels and Piping.  191 (2021)  - p. 104343 , 2021
Link: https://doi.org/10.1016/..
 
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4

Characterization of plastic and creep behavior in thick alu..:

Shishido, Nobuyuki ; Setoguchi, Yoshiki ; Kumagai, Yuto...
Microelectronics Reliability.  123 (2021)  - p. 114185 , 2021
Link: https://doi.org/10.1016/..
 
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5

A multidimensional scheme of characterization for performan..:

Kamiya, Shoji ; Izumi, Hayato ; Sekine, Tomohito...
Thin Solid Films.  694 (2020)  - p. 137613 , 2020
Link: https://doi.org/10.1016/..
 
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6

High‐Strength Sub‐Micrometer Spherical Particles Fabricated..:

Kondo, Mitsuhiko ; Shishido, Nobuyuki ; Kamiya, Shoji...
Particle & Particle Systems Characterization.  35 (2018)  7 - p. , 2018
Link: https://doi.org/10.1002/..
 
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7

Investigation of continuous deformation behavior around ini..:

Koiwa, Kozo ; Shishido, Nobuyuki ; Chen, Chuantong...
Scripta Materialia.  111 (2016)  - p. 94-97 , 2016
Link: https://doi.org/10.1016/..
 
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8

Specimen size effect on elastic–plastic strength evaluation..:

Chen, Chuantong ; Koiwa, Kozo ; Shishido, Nobuyuki...
Engineering Fracture Mechanics.  131 (2014)  - p. 371-381 , 2014
Link: https://doi.org/10.1016/..
 
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9

Evaluation for interface strength fluctuations induced by i..:

Chen, Chuantong ; Shishido, Nobuyuki ; Kamiya, Shoji...
Microelectronic Engineering.  120 (2014)  - p. 52-58 , 2014
Link: https://doi.org/10.1016/..
 
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10

Local distribution of residual stress of Cu in LSI intercon..:

Sato, Hisashi ; Shishido, Nobuyuki ; Kamiya, Shoji...
Materials Letters.  136 (2014)  - p. 362-365 , 2014
Link: https://doi.org/10.1016/..
 
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11

Crystal orientation effect on local adhesion strength of th..:

Shishido, Nobuyuki ; Oura, Yuka ; Sato, Hisashi...
Microelectronic Engineering.  120 (2014)  - p. 71-76 , 2014
Link: https://doi.org/10.1016/..
 
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12

Grain-scale adhesion strength mapping of copper wiring stru..:

Kamiya, Shoji ; Shishido, Nobuyuki ; Watanabe, Shinsuke...
Surface and Coatings Technology.  215 (2013)  - p. 280-284 , 2013
Link: https://doi.org/10.1016/..
 
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13

Non-linear analyses of strain in flip chip packages improve..:

Ikeda, Toru ; Kanno, Toshifumi ; Shishido, Nobuyuki...
Microelectronics Reliability.  53 (2013)  1 - p. 145-153 , 2013
Link: https://doi.org/10.1016/..
 
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14

Experimental and numerical evaluation of interfacial adhesi..:

Omiya, Masaki ; Koiwa, Kozo ; Shishido, Nobuyuki...
Microelectronics Reliability.  53 (2013)  4 - p. 612-621 , 2013
Link: https://doi.org/10.1016/..
 
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15

Development of Cu/Insulation Layer Interface Crack Extensio..:

Koiwa, Kozo ; Omiya, Masaki ; Shishido, Nobuyuki...
Japanese Journal of Applied Physics.  52 (2013)  4S - p. 04CB05 , 2013
Link: https://doi.org/10.7567/..
 
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