Shubhakar, K.
24  results:
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2

Reliability and Breakdown Study of Erase Gate Oxide in Spli..:

, In: 2020 IEEE International Reliability Physics Symposium (IRPS),
Luo, L. ; Shubhakar, K. ; Mei, S.... - p. 1-6 , 2020
 
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3

3D characterization of hard breakdown in RRAM device:

Mei, S. ; Bosman, M. ; Shubhakar, K....
Microelectronic Engineering.  216 (2019)  - p. 111042 , 2019
 
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40nm Embedded Self-Aligned Split-Gate Flash Technology for ..:

, In: 2017 IEEE International Memory Workshop (IMW),
Shum, Danny ; Luo, Lai Q. ; Kong, Y.J.... - p. 1-4 , 2017
 
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8

Analysis of quantum conductance, read disturb and switching..:

Ranjan, A. ; Raghavan, N. ; Molina, J....
Microelectronics Reliability.  64 (2016)  - p. 172-178 , 2016
 
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9

Conductive filament formation at grain boundary locations i..:

Shubhakar, K. ; Mei, S. ; Bosman, M....
Microelectronics Reliability.  64 (2016)  - p. 204-209 , 2016
 
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11

Effects of thermal annealing on the charge localization cha..:

Feng, Xuan ; Dong, Shurong ; Wong, Hei...
Microelectronics Reliability.  61 (2016)  - p. 78-81 , 2016
 
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12

An SEM/STM based nanoprobing and TEM study of breakdown loc..:

Shubhakar, K. ; Bosman, M. ; Neucheva, O.A....
Microelectronics Reliability.  55 (2015)  9-10 - p. 1450-1455 , 2015
 
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13

Impact of local structural and electrical properties of gra..:

Shubhakar, K. ; Raghavan, N. ; Kushvaha, S.S....
Microelectronics Reliability.  54 (2014)  9-10 - p. 1712-1717 , 2014
 
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15

Necessity for quantum mechanical simulation for the future ..:

, In: 2007 International Workshop on Physics of Semiconductor Devices,
 
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