Silva, Benjamín
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2

Challenges for Enabling Multiple High-Speed Interfaces On A..:

, In: 2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI),
 
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4

LPDDR4 SIPI Co-Simulation and Measurement Correlation for I..:

, In: 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS),
 
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5

Intuitive PI: Simulator-less Analysis Methodology:

, In: 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS),
Silva, Benjamin ; Shen, Yan Fen - p. 1-3 , 2019
 
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6

Signal/Power Integrity Tradeoffs in Automotive SoC Package ..:

, In: 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS),
 
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8

Procedure for length matching of daisy-chained clock and co..:

Ong, Chong-Jin ; Silva, Benjamin P. ; Chen, Houfei
IEEE Electromagnetic Compatibility Magazine.  8 (2019)  2 - p. 54-56 , 2019
 
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