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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
3
Sub-0.5 μm Pitch Scaling of W2W Cu/Dielectric Hybrid Bondin:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Low Thermal Budget Fine-pitch Cu/Dielectric Hybrid Bonding ..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
5
Cu/Dielectric hybrid bonding among Glass and Si:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
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Defect evolution during through-silicon via copper electrop..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Alignment through thick Si layer for high resolution patter..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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CMOS-Compatible Fine Pitch Al-Al Bonding:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
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Patterning on reflective (Al) surface using auto alignment ..:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
10
Study of Cu Pad Expansion with Surrounding Dielectrics for ..:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
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Cu and barrier CMP process development with fine 1μm Cu bon..:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
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Ultrathin New Dielectric Interlayer Layer - Enhancer for TE..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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