E-LIB Suche - Ergebnisse für: Singh, Pushpapraj

1

Thermal Analysis of High-Performance Server SoCs from FinFE..:

, In: 2024 IEEE International Reliability Physics Symposium (IRPS),

Kumar, Nitish ; Sankatali, Venkateswarlu ; Chen, Yukai... - p. 8B.4-1-8B.4-8 , 2024

2

Electrostatically actuated all metal MEMS Pirani gauge with..:

Garg, Manu ; Arya, Dhairya Singh ; Kumar, Sushil...
Journal of Micromechanics and Microengineering. 34 (2024) 2 - p. 025003 , 2024

Link: https://doi.org/10.1088/..

3

Nanogap CMOS-MEMS Pirani Gauge Based on Titanium-Nitride He..:

Garg, Manu ; Singh, Pushpapraj ; Chiu, Yi
IEEE Transactions on Electron Devices. 71 (2024) 2 - p. 1214-1219 , 2024

Link: https://doi.org/10.1109/..

4

Ultrasensitive Reduced Vanadium Dioxide-Based MEMS Pirani G..:

, In: Springer Proceedings in Physics; The Physics of Semiconductor Devices,

Garg, Manu ; Joshi, Khanjan ; Arya, Dhairya S.... - p. 311-318 , 2024

Link: https://doi.org/10.1007/..

5

Electrothermal analysis of a simple MEMS Pirani Gauge with ..:

, In: 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),

Kumari, Ashwini ; Garg, Manu ; Kumar, Piyush. - p. 1-3 , 2024

Link: https://doi.org/10.1109/..

6

Recent progress in molybdenum disulfide (MoS2) based flexib..:

Srivastava, Mayuri ; Banerjee, Swagata ; Bairagi, Satyaranjan...
Chemical Engineering Journal. 480 (2024) - p. 147963 , 2024

Link: https://doi.org/10.1016/..

7

Leakage Current and Hot-Carrier Injection in the Junctionle..:

Kumar, Nitish ; Gupta, Ankur ; Singh, Pushpapraj
IEEE Transactions on Electron Devices. 71 (2024) 7 - p. 4420-4423 , 2024

Link: https://doi.org/10.1109/..

8

Piezoresistive sensitivity enhancement below threshold volt..:

Kumar, Nitish ; Joshi, Khanjan ; Gupta, Ankur.
Nanotechnology. 35 (2024) 33 - p. 335501 , 2024

Link: https://doi.org/10.1088/..

9

Self-Heating Mapping of the Experimental Device and Its Opt..:

Kumar, Nitish ; Pali, Shraddha ; Gupta, Ankur.
IEEE Transactions on Device and Materials Reliability. 24 (2024) 1 - p. 33-40 , 2024

Link: https://doi.org/10.1109/..

10

Impact of Back End of Line (BEOL) and Ambient Temperature o..:

, In: 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),

Kumar, Nitish ; Gupta, Karan ; Gupta, Ayush.. - p. 1-3 , 2024

Link: https://doi.org/10.1109/..

11

A compact and reconfigurable C-band DGS-based power divider..:

Narang, Niharika ; Shrivastava, Pranav Kumar ; Basu, Ananjan.
Journal of Micromechanics and Microengineering. 34 (2024) 3 - p. 035002 , 2024

Link: https://doi.org/10.1088/..

12

Modeling of inner-outer gates and temperature dependent gat..:

Kumar, Nitish ; Mishra, Aakanksha ; Gupta, Ankur.
Microelectronics Journal. 146 (2024) - p. 106155 , 2024

Link: https://doi.org/10.1016/..

13

High Capacitive Ratio Molybdenum-based RF MEMS Capacitive S..:

, In: 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),

Narang, Nihaika ; Kumar, Piyush ; Shrivastava, Pranav Kumar.. - p. 1-3 , 2024

Link: https://doi.org/10.1109/..

14

Electro-Thermal Properties and Self-Heating Effect in Multi..:

, In: 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),

Kumar, Nitish ; Ashok Bhinge, Kanyakumari ; Gupta, Ankur. - p. 1-3 , 2023

Link: https://doi.org/10.1109/..

15

A Finite Element Analysis of MEMS-based Magnetoelectric Mic..:

, In: 2023 IEEE Microwaves, Antennas, and Propagation Conference (MAPCON),

Ali, Sazid ; Yousuf, Mujeeb ; Singh, Pushpapraj - p. 1-5 , 2023

Link: https://doi.org/10.1109/..