E-LIB Suche - Ergebnisse für: Sitek, Janusz

1

Wetting and Interfacial Chemistry of New Pb-Free Sn-Zn-Ag-A..:

Dybeł, Aleksandra ; Czaja, Paweł ; Sitek, Janusz.
Journal of Materials Engineering and Performance. 32 (2023) 13 - p. 5723-5730 , 2023

Link: https://doi.org/10.1007/..

2

Comparison of SAC and new Pb-free solder alloy for special ..:

, In: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC),

Arazna, Aneta ; Koscielski, Marek ; Sitek, Anna... - p. 1-6 , 2020

Link: https://doi.org/10.1109/..

3

Recovery of valuable BGA components from used electronic mo..:

, In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC),

Koscielski, Marek ; Sitek, Janusz ; Ciszewski, Piotr... - p. 1-5 , 2019

Link: https://doi.org/10.23919..

4

The dependence of reliability and mechanical strength of th..:

Sitek, Janusz ; Koscielski, Marek ; Borecki, Janusz.
Soldering & Surface Mount Technology. 29 (2017) 1 - p. 23-27 , 2017

Link: https://doi.org/10.1108/..

5

Materials and soldering challenges in lead-free Package-on-..:

Kościelski, Marek ; Sitek, Janusz ; Stęplewski, Wojciech...
Soldering & Surface Mount Technology. 27 (2015) 3 - p. 103-107 , 2015

Link: https://doi.org/10.1108/..

6

Influence of thermal cycling on reliability of solder joint..:

Sitek, Janusz ; Araźna, Aneta ; Janeczek, Kamil...
Soldering & Surface Mount Technology. 27 (2015) 3 - p. 120-124 , 2015

Link: https://doi.org/10.1108/..

7

Influence of assembly parameters on lead-free solder joints..:

Sitek, Janusz ; Stęplewski, Wojciech ; Janeczek, Kamil...
Soldering & Surface Mount Technology. 27 (2015) 3 - p. 98-102 , 2015

Link: https://doi.org/10.1108/..

8

Characterization of nano-enhanced interconnect materials fo..:

Zhang, Yan ; Sitek, Janusz ; Fan, Jing-yu...
Soldering & Surface Mount Technology. 26 (2014) 1 - p. 12-17 , 2014

Link: https://doi.org/10.1108/..

9

Influence of micro additives on printing and electric param..:

Sitek, Janusz ; Koscielski, Marek ; Agata Skwarek, Dr
Circuit World. 40 (2014) 1 - p. 2-6 , 2014

Link: https://doi.org/10.1108/..

10

Influence of the fluxes properties on quality and the micro..:

Koscielski, Marek ; Sitek, Janusz ; Agata Skwarek, Dr
Soldering & Surface Mount Technology. 26 (2014) 1 - p. 2-7 , 2014

Link: https://doi.org/10.1108/..

11

SAC solder paste with carbon nanotubes. Part II: carbon nan..:

Bukat, Krystyna ; Sitek, Janusz ; Koscielski, Marek...
Soldering & Surface Mount Technology. 25 (2013) 4 - p. 195-208 , 2013

Link: https://doi.org/10.1108/..

12

Investigation of the wetting of PCBs with SnCu (HASL) and S..:

Bukat, Krystyna ; Sitek, Janusz ; Koscielski, Marek...
Soldering & Surface Mount Technology. 24 (2012) 1 - p. 4-11 , 2012

Link: https://doi.org/10.1108/..

13

Thermophysical properties and wetting behavior on Cu of sel..:

Fima, Przemyslaw ; Gancarz, Tomasz ; Pstrus, Janusz..
Soldering & Surface Mount Technology. 24 (2012) 2 - p. 71-76 , 2012

Link: https://doi.org/10.1108/..

14

A comparison of the quality of lead‐free solder pastes:

Sitek, Janusz ; Ročak, Dubravka ; Bukat, Krystyna..
Soldering & Surface Mount Technology. 16 (2004) 3 - p. 22-30 , 2004

Link: https://doi.org/10.1108/..

15

Influence of Ion Nitriding on Microstructure and Properties..:

Sitek, Ryszard ; Kulikowski, Krzysztof ; Paradowski, Krystian...
Materials. 16 (2023) 14 - p. 5020 , 2023

Link: https://doi.org/10.3390/..