Slabbekoorn, J.
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1

(Why do we need) Wireless Heterogeneous Integration (anyway..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Peeters, M. ; Sinha, S. ; Sun, X.... - p. 256-257 , 2022
 
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2

Cost-effective RF interposer platform on low-resistivity Si..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Sun, X. ; Slabbekoorn, J. ; Sinha, S.... - p. 7-11 , 2022
 
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3

Novell embedded microbump approach for die-to-die and wafer..:

, In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC),
Derakhshandeh, J. ; Beyne, E. ; Capuz, G.... - p. 1-6 , 2019
 
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4

Surface morphologies of excimer-laser annealed BF2+ implant..:

Burtsev, A. ; Schut, H. ; Nanver, L.K....
Materials Science and Engineering: B.  114-115 (2004)  - p. 109-113 , 2004
 
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5

Characterization of front- to backwafer bulk micromachining..:

Zeijl, H W van ; Slabbekoorn, J
Journal of Micromechanics and Microengineering.  13 (2003)  4 - p. S108-S112 , 2003
 
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8

IR Laser Release for 3D Stacked Devices: Effect of the Rele..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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9

Inorganic capping layers in advanced photosensitive polymer..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Pinho, Nelson ; Chery, Emmanuel ; Bhatia, Ritwik... - p. 2040-2045 , 2023
 
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13

Detection of bonding voids in multi-tier stacks with scanni..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Chen, Cong ; Slabbekoorn, John ; Bogdanowicz, Janusz... - p. 320-325 , 2023
 
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15

An Investigation on Particle Embedding Capability of Wafer ..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Noda, Hiroto ; Hiro, Akito ; Nishiguchi, Naoki... - p. 1677-1681 , 2023
 
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