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Snugovsky, Polina
6
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1
Tin Whisker Growth on Electronic Assemblies Soldered with B..:
Delhaise, André M.
;
Bagheri, Zohreh
;
Meschter, Stephan
..
Journal of Electronic Materials. 50 (2020) 3 - p. 842-854 , 2020
Link:
https://doi.org/10.1007/..
?
2
Thermal Preconditioning and Restoration of Bismuth-Containi..:
Delhaise, André M.
;
Snugovsky, Polina
;
Kennedy, Jeff
...
Journal of Electronic Materials. 49 (2019) 1 - p. 116-127 , 2019
Link:
https://doi.org/10.1007/..
?
3
Whisker Formation Induced by Component and Assembly Ionic C..:
Snugovsky, Polina
;
Meschter, Stephan
;
Bagheri, Zohreh
...
Journal of Electronic Materials. 41 (2011) 2 - p. 204-223 , 2011
Link:
https://doi.org/10.1007/..
?
4
Microstructure and Reliability Comparison of Different Pb-F..:
Snugovsky, Polina
;
Bagheri, Zohreh
;
Hamilton, Craig
Journal of Electronic Materials. 38 (2009) 12 - p. 2628-2646 , 2009
Link:
https://doi.org/10.1007/..
?
5
Microstructure, Defects, and Reliability of Mixed Pb-Free/S..:
Snugovsky, Polina
;
McCormick, Heather
;
Bagheri, Simin
...
Journal of Electronic Materials. 38 (2008) 2 - p. 292-302 , 2008
Link:
https://doi.org/10.1007/..
?
6
Temperature profile effects in accelerated thermal cycling ..:
Qi, Yan
;
Lam, Rex
;
Ghorbani, Hamid R.
..
Microelectronics Reliability. 46 (2006) 2-4 - p. 574-588 , 2006
Link:
https://doi.org/10.1016/..
1-6