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Sohn, Dong Kyun
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1

Design, assembly and reliability of large die and fine-pitc..:

Ong, Yue Ying ; Ho, Soon Wee ; Vaidyanathan, Kripesh...
Microelectronics Reliability.  50 (2010)  7 - p. 986-994 , 2010
Link: https://doi.org/10.1016/..
 
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2

Underfill selection methodology for fine pitch Cu/low-k FCB..:

Ong, Xuefen ; Ho, Soon Wee ; Ong, Yue Ying...
Microelectronics Reliability.  49 (2009)  2 - p. 150-162 , 2009
Link: https://doi.org/10.1016/..
 
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3

Structural Design and Optimization of 65nm Cu/low-k Flipchi..:

, In: 2007 9th Electronics Packaging Technology Conference,
Ong, Jimmy ; Tay, Andrew ; Zhang, Xiaowu... - p. None , 2007
Link: https://doi.org/10.1109/..
 
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4

A Systematic Underfill Selection Methodology for Fine Pitch..:

, In: 2007 9th Electronics Packaging Technology Conference,
Ong, Xuefen ; Sohn, Dong Kyun ; Hsia, Liang Choo... - p. None , 2007
Link: https://doi.org/10.1109/..
 
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5

Increased Thermal Stability of W/Ta2O5 Gate Structure Using..:

Cho, Ihl Hyun ; Park, Ji-Soo ; Sohn, Dong Kyun.
Japanese Journal of Applied Physics.  40 (2001)  8R - p. 4854 , 2001
Link: https://doi.org/10.1143/..
 
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6

A Study on Thermal Stability of CoSi2 EmployingNovel Fine-G..:

Bae, Jong-Uk ; Sohn, Dong Kyun ; Park, Ji-Soo...
Japanese Journal of Applied Physics.  40 (2001)  11R - p. 6307 , 2001
Link: https://doi.org/10.1143/..
 
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7

In situ barrier formation using rapid thermal annealing of ..:

Lee, Byung Hak ; Lee, Kee Sun ; Sohn, Dong Kyun...
Applied Physics Letters.  76 (2000)  18 - p. 2538-2540 , 2000
Link: https://doi.org/10.1063/..
 
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8

Improvement of Reverse Leakage Current by Fluorine Implanta..:

Park, Ji-Soo ; Sohn, Dong Kyun ; Bae, Jong-Uk...
Japanese Journal of Applied Physics.  39 (2000)  2B - p. L156 , 2000
Link: https://doi.org/10.1143/..
 
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9

Effect of Wet Etched Thickness and Reoxidation on Reliabili..:

Cho, Ihl Hyun ; Sung, Nag Kyunn ; Oh, Jong Hyuk...
Japanese Journal of Applied Physics.  39 (2000)  4S - p. 2167 , 2000
Link: https://doi.org/10.1143/..
 
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10

Improvement of Gate Oxide Reliability for Direct Tungsten-G..:

Han, Chang Hee ; Sohn, Dong Kyun ; Lee, Byung Hak...
Japanese Journal of Applied Physics.  39 (2000)  8A - p. L796 , 2000
Link: https://doi.org/10.1143/..
 
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11

Suppression of Arsenic Loss by Phosphorus Co-Implantation i..:

Park, Ji-Soo ; Sohn, Dong Kyun ; Bae, Jong-Uk.
Japanese Journal of Applied Physics.  38 (1999)  7A - p. L694 , 1999
Link: https://doi.org/10.1143/..
 
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12

Effect of pre-amorphization of polycrystalline silicon on a..:

Bae, Jong-Uk ; Sohn, Dong Kyun ; Park, Ji-Soo...
Journal of Applied Physics.  86 (1999)  9 - p. 4943-4948 , 1999
Link: https://doi.org/10.1063/..
 
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13

Reduction of Dichlorosiliane‐Based Tungsten Silicide Resist..:

Byun, Jeong Soo ; Lee, Byung Hak ; Park, Ji‐Soo...
Journal of The Electrochemical Society.  146 (1999)  6 - p. 2261-2269 , 1999
Link: https://doi.org/10.1149/..
 
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14

Reduction of Leakage Current for Shallow n  +  / p Junction..:

Sohn, Dong Kyun ; Park, Ji‐Soo ; Bae, Jong‐Uk...
Journal of The Electrochemical Society.  146 (1999)  10 - p. 3837-3842 , 1999
Link: https://doi.org/10.1149/..
 
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15

Degradation of Reactively Sputtered Ti‐Si‐N Films Used as a..:

Park, Ji‐Soo ; Sohn, Dong Kyun ; Lee, Byung Hak...
Journal of The Electrochemical Society.  146 (1999)  4 - p. 1579-1582 , 1999
Link: https://doi.org/10.1149/..
 
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