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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Fusing Current Characterization of Various Cu RDL Designs i..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Thermal Performance of an Indium-Silver Alloy Metal TIM for..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Electromigration Performance of Fine-Line Cu Redistribution..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Reliability Performance of S-Connect Module (Bridge Technol..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Thermal Performance of Advanced TIMs for High-Power FCLBGAs:
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2007 International Conference on Electronic Materials and Packaging ,
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