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Somidin, Flora
27  results:
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1

In-situ observations of CU6Sn5 mophological changes at the ..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Nogita, Kazuhiro ; Tan, Xin F. ; Somidin, Flora... - p. 215-216 , 2024
Link: https://doi.org/10.23919..
 
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2

Influence of recycled wastes on ferrosilicon production in ..:

Ismail, Anis Nadhirah ; Ibrahim, Mohd Hakim ; Mohd Said, Rita..
Journal of Physics: Conference Series.  2169 (2022)  1 - p. 012028 , 2022
Link: https://doi.org/10.1088/..
 
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3

Recent Progress in Transient Liquid Phase (TLP) Solder for ..:

, In: Recent Progress in Lead-Free Solder Technology; Topics in Mining, Metallurgy and Materials Engineering,
Somidin, Flora ; Said, Rita Mohd ; Saud, Norainiza. - p. 95-112 , 2022
Link: https://doi.org/10.1007/..
 
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4

Mixed Assembly of Lead-free Solder Joint: A Short Review:

Said, Rita Mohd ; Salleh, Mohd Arif Anuar Mohd ; Ramli, Mohd Izrul Izwan...
Journal of Physics: Conference Series.  2169 (2022)  1 - p. 012039 , 2022
Link: https://doi.org/10.1088/..
 
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5

Investigation of the Effects of Surface Finish and Reflow C..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Somidin, Flora ; Akaiwa, Tetsuya ; McDonald, Stuart D.... - p. 177-178 , 2022
Link: https://doi.org/10.23919..
 
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6

In Situ Observation of Liquid Solder Alloys and Solid Subst..:

Tan, Xin F. ; Somidin, Flora ; McDonald, Stuart D....
Materials.  15 (2022)  2 - p. 510 , 2022
Link: https://doi.org/10.3390/..
 
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7

Microstructure Study of Mix Assembly Lead-free Sn-Ag-Cu Bal..:

Said, Rita Mohd ; Sulwarajan, Kalaiarasi A/P ; Razak, Nurul Razliana Abdul..
Journal of Physics: Conference Series.  2169 (2022)  1 - p. 012010 , 2022
Link: https://doi.org/10.1088/..
 
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8

Microstructural Evolution of Cu/Sn-58Bi/Sn-3.0Ag-0.5Cu Comp..:

Somidin, Flora ; Abu Bakar, Muhammad Fakarudin ; Abdul Razak, Nurul Razliana
Journal of Physics: Conference Series.  2169 (2022)  1 - p. 012024 , 2022
Link: https://doi.org/10.1088/..
 
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9

Recent Studies in the Development of Ceramic-Reinforced Lea..:

, In: Recent Progress in Lead-Free Solder Technology; Topics in Mining, Metallurgy and Materials Engineering,
Saud, Norainiza ; Mohd Salleh, Mohd Arif Anuar ; Mohd Said, Rita... - p. 3-24 , 2022
Link: https://doi.org/10.1007/..
 
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10

Atomic insights into the ordered solid solutions of Ni and ..:

Yang, Wenhui ; Tran, Xuan Quy ; Yamamoto, Tomokazu...
Acta Materialia.  224 (2022)  - p. 117513 , 2022
Link: https://doi.org/10.1016/..
 
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11

Influence of Fly Ash Geopolymer Ceramic Powder Addition on ..:

Somidin, Flora ; Natasha Ilias, Nur Fatin ; Mohamad Zaimi, Nur Syahirah..
Journal of Physics: Conference Series.  2169 (2022)  1 - p. 012032 , 2022
Link: https://doi.org/10.1088/..
 
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12

Direct observation of the Ni stabilising effect in interfac..:

Somidin, Flora ; Maeno, Hiroshi ; Toriyama, Takaaki...
Materialia.  9 (2020)  - p. 100530 , 2020
Link: https://doi.org/10.1016/..
 
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13

Atomic locations of minor dopants and their roles in the st..:

Yang, Wenhui ; Quy Tran, Xuan ; Yamamoto, Tomokazu...
Physical Review Materials.  4 (2020)  6 - p. , 2020
Link: https://doi.org/10.1103/..
 
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14

Reducing Cracking in Solder Joint Interfacial Cu6Sn5 with M..:

Somidin, Flora ; McDonald, Stuart David ; Ye, Xiaozhou...
Transactions of The Japan Institute of Electronics Packaging.  13 (2020)  0 - p. E19-004-1-E19-004-11 , 2020
Link: https://doi.org/10.5104/..
 
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15

In-Situ Observation of the Continuous Phase Transition in D..:

Dargusch, Matthew ; Shi, Xiao-Lei ; Tran, Xuan Quy...
The Journal of Physical Chemistry Letters.  10 (2019)  21 - p. 6512-6517 , 2019
Link: https://doi.org/10.1021/..
 
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