Son, Ho-Young
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1

Vertical Fan Out(VFO) package with enhanced form factor and..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Sung, Ki-Jun ; Eun, Kyoungtae ; Kim, Jae-Min... - p. 34-39 , 2024
 
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2

Reevaluation of failure criteria location and novel improve..:

Ju, Bu-Seog ; Son, Ho-Young
Nuclear Engineering and Technology.  55 (2023)  9 - p. 3493-3505 , 2023
 
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4

A noble VFO(Vertical wire Fan Out) technology for small for..:

, In: 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
Sung, Ki-Jun ; Eun, Kyoungtae ; Lee, Seowon... - p. 1-4 , 2023
 
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5

Advanced Packaging Technologies in Memory Applications for ..:

, In: 2023 International Electron Devices Meeting (IEDM),
 
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8

Early onset female pattern hair loss: A case–control study ..:

Ohn, Jungyoon ; Son, Ho-Young ; Yu, Da-Ae...
Journal of Dermatological Science.  106 (2022)  1 - p. 21-28 , 2022
 
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11

Fan-out Wafer Level Package for Memory Applications:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Son, Ho-Young ; Sung, Ki-Jun ; Choi, Bok-Kyu.. - p. 1349-1354 , 2022
 
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12

Dynamic characteristics of single door electrical cabinet u..:

Jeon, Bub-Gyu ; Son, Ho-Young ; Eem, Seung-Hyun..
Nuclear Engineering and Technology.  53 (2021)  7 - p. 2387-2395 , 2021
 
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