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2023 International Conference on Electronics Packaging (ICEP) ,
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Physical Properties of Large Cu Grain and Application to Cu..:
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2023 IEEE International 3D Systems Integration Conference (3DIC) ,
2
Copper Electrode Surface Features and Cu-SiO2Hybrid Bonding:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Chip-to-Chip Hybrid Bonding with Larger-Oriented Cu Grains ..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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