Song, Jinwook
185  results:
Search for persons X
?
1

Imitation Learning-based Equalizer Design Optimization Meth..:

, In: 2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS),
Kim, Jihun ; Choi, Seonguk ; Shin, Taein... - p. 1-3 , 2023
 
?
2

SI/PI Co-Design of 12.8 Gbps HBM I/O Interface using Bayesi..:

, In: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI),
Shin, Taein ; Park, Hyunwook ; Lho, Daehwan... - p. 662-667 , 2023
 
?
3

PCB-level Jitter Sensitivity Measurement and Hierarchical P..:

, In: 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS),
Ko, Youngjun ; Song, Jinwook ; Hong, Seokwoo... - p. 1-3 , 2023
 
?
4

Signal Integrity Design and Analysis of Universal Chiplet I..:

, In: 2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS),
Shin, Taein ; Kim, Keunwoo ; Park, Hyunwook... - p. 1-3 , 2023
 
?
5

Novel Target-Impedance Extraction Method-Based Optimal PDN ..:

Song, Jinwook ; Jung, Daniel Hyunsuk ; Shin, Jaeyoung...
IEEE Transactions on Signal and Power Integrity.  2 (2023)  - p. 1-12 , 2023
 
?
6

Deep Reinforcement Learning-Based Optimal and Fast Hybrid E..:

Choi, Seonguk ; Son, Keeyoung ; Park, Hyunwook...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  13 (2023)  11 - p. 1804-1816 , 2023
 
?
7

Scalable Transformer Network-based Reinforcement Learning M..:

, In: 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS),
Park, Hyunwook ; Shin, Taein ; Kim, Seongguk... - p. 1-3 , 2022
 
?
8

Imitation Learning for Simultaneous Escape Routing:

, In: 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS),
Kim, Minsu ; Park, Hyunwook ; Son, Keeyoung... - p. 1-3 , 2021
 
?
9

PAM-4 based PCIe 6.0 Channel Design Optimization Method usi..:

, In: 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS),
Kim, Jihun ; Park, Hyunwook ; Kim, Minsu... - p. 1-3 , 2021
 
?
10

Design and Measurement of a Novel On-Interposer Active Powe..:

Kim, Subin ; Kim, Youngwoo ; Cho, Kyungjun..
IEEE Transactions on Components, Packaging and Manufacturing Technology.  9 (2019)  2 - p. 317-328 , 2019
 
?
11

Design and Analysis of Interposer-Level Integrated Voltage ..:

, In: 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS),
Kim, Subin ; Kim, Youngwoo ; Cho, Kyungjun... - p. 159-161 , 2018
 
?
14

Design and analysis of wireless power transfer system using..:

, In: 2017 IEEE Wireless Power Transfer Conference (WPTC),
 
?
15

Safety and reliability verification process of coil module ..:

, In: 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS),
Kim, Jonghoon ; Kim, Jonghoon J. ; Kim, Hongseok... - p. 144-147 , 2015
 
1-15