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2022 23rd International Conference on Electronic Packaging Technology (ICEPT) ,
4
Research on PCT Reliability of Power Devices based on FOPLP:
, In:
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2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ,
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Research On FOPLP Package of multi-chip Power Module:
, In:
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Lecture Notes in Civil Engineering; Proceedings of the 11th International Conference on Behaviour of Steel Structures in Seismic Areas ,
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