Sousa, Isabel
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1

Reliable Chiplet Integration on High Density Laminate (2.XD..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Taneja, Divya ; Grenier, Jonathan ; Ross, Joseph... - p. 581-586 , 2024
 
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8

A formação em Serviço Social em Portugal:

Casquilho-Martins, Inês ; Sousa, Isabel de
Revista Brasileira de História da Educação.  24 (2024)  1 - p. e330 , 2024
 
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9

Scalable Advanced DBHi Chiplet Package Using Silicon Bridge..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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11

Additive manufacturing of high-density (2.5 micrometer L/S)..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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