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Industrial Artificial Intelligence Technologies and Applications ,
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Feasibility of Wafer Exchange for European Edge AI Pilot Li..:
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2020 IEEE International Reliability Physics Symposium (IRPS) ,
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Relevance of fin dimensions and high-pressure anneals on ho..:
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Proceedings of the 56th Annual Design Automation Conference 2019 ,
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Process, Circuit and System Co-optimization of Wafer Level ..:
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2019 IEEE International Electron Devices Meeting (IEDM) ,
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Buried Power Rails and Back-side Power Grids: Arm® CPU Powe..:
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2019 IEEE International Integrated Reliability Workshop (IIRW) ,
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