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Stegmann, Tamira
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Understanding the Influence of Copper Substrate Oxidation o..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Stegmann, Tamira ; Schwobel, Andre ; Schmitt, Wolfgang... - p. 635-642 , 2023
Link: https://doi.org/10.1109/..
 
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Die Attachment on Bare Copper Surface by Non-Pressure Silve..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Chew, Ly May ; Stegmann, Tamira ; Schwenk, Erika. - p. 289-293 , 2019
Link: https://doi.org/10.1109/..
 
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