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Straubinger, Dániel
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1

Bulge-Free and Homogeneous Metal Line Jet Printing with Sta..:

Straubinger, Dániel ; Koltay, Peter ; Zengerle, Roland..
Micromachines.  15 (2024)  6 - p. 743 , 2024
Link: https://doi.org/10.3390/..
 
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2

Impact of electromigration and isothermal ageing on lead-fr..:

Straubinger, Dániel ; Hurtony, Tamás ; Géczy, Attila
Journal of Materials Research and Technology.  21 (2022)  - p. 308-318 , 2022
Link: https://doi.org/10.1016/..
 
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3

Novel PLA/Flax Based Biodegradable Printed Circuit Boards:

, In: 2022 45th International Spring Seminar on Electronics Technology (ISSE),
Geczy, Attila ; Csiszar, Andras ; Rozs, Egon... - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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4

Modelling of thermocouple geometry variations for improved ..:

Straubinger, Dániel ; Illés, Balázs ; Busek, David..
Case Studies in Thermal Engineering.  33 (2022)  - p. 102001 , 2022
Link: https://doi.org/10.1016/..
 
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5

Application of ZnO Nanoparticles in Sn99Ag0.3Cu0.7-Based Co..:

Skwarek, Agata ; Krammer, Olivér ; Hurtony, Tamás...
Nanomaterials.  11 (2021)  6 - p. 1545 , 2021
Link: https://doi.org/10.3390/..
 
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6

Heat transfer aspects of condensation during vapour phase s..:

Straubinger, Daniel ; Bozsóki, István ; Illes, Balazs...
Soldering & Surface Mount Technology.  32 (2020)  4 - p. 247-252 , 2020
Link: https://doi.org/10.1108/..
 
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7

Electromigration in lead-free solder joints on ceramic PCB ..:

, In: 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME),
Straubinger, Daniel ; Rigler, Daniel ; Geczy, Attila. - p. 52-56 , 2020
Link: https://doi.org/10.1109/..
 
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8

Simulation of reflow-based heat transfer on different therm..:

, In: 2020 43rd International Spring Seminar on Electronics Technology (ISSE),
Straubinger, Daniel ; Illes, Balazs ; Berenyi, Richard. - p. 1-6 , 2020
Link: https://doi.org/10.1109/..
 
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9

Modelling of temperature distribution along PCB thickness i..:

Straubinger, Daniel ; Bozsóki, István ; Bušek, David..
Circuit World.  46 (2019)  2 - p. 85-92 , 2019
Link: https://doi.org/10.1108/..
 
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10

Scaling of Components for Explicit Modelling of Heat Transf..:

, In: 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME),
Straubinger, Daniel ; Bozsoki, Istvan ; Gal, Laszlo. - p. 155-159 , 2019
Link: https://doi.org/10.1109/..
 
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11

Investigating shadowing and possible tombstoning caused by ..:

, In: 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME),
Geczy, Attila ; Szalmasi, Daniel ; Straubinger, Daniel. - p. 343-346 , 2019
Link: https://doi.org/10.1109/..
 
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12

Advances on high current load effects on lead-free solder j..:

Straubinger, Dániel ; Géczy, Attila ; Sipos, András...
Circuit World.  45 (2019)  1 - p. 37-44 , 2019
Link: https://doi.org/10.1108/..
 
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13

Effects of high current density on lead-free solder joints ..:

Geczy, Attila ; Straubinger, Daniel ; Kovacs, Andras...
Soldering & Surface Mount Technology.  30 (2018)  2 - p. 74-80 , 2018
Link: https://doi.org/10.1108/..
 
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14

Modelling of thermocouple geometry variations for improved ..:

Dániel Straubinger ; Balázs Illés ; David Busek..
http://www.sciencedirect.com/science/article/pii/S2214157X22002477.  , 2022
Link: https://doi.org/10.1016/..
 
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15

Impact of electromigration and isothermal ageing on lead-fr..:

Dániel Straubinger ; Tamás Hurtony ; Attila Géczy
http://www.sciencedirect.com/science/article/pii/S2238785422014557.  , 2022
Link: https://doi.org/10.1016/..
 
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