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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
1
Optimization of 2.2D Underfill Process by Novel Methodology..:
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2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
2
Advanced Optical Metrology for Stability Monitoring of Poly..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
5
A Novel Equivalent Model for Underfill Molding Process On 2..:
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2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
6
A Novel Modelling Methodology for Underfill Molding Process..:
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2023 International Conference on Electronics Packaging (ICEP) ,
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