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Sun, Huhao
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1

A Ku band instantaneous wideband SIP integrated microwave r..:

Wang, Yong ; Wei, Wei ; Sun, Huhao...
IEICE Electronics Express.  21 (2024)  2 - p. 20230543-20230543 , 2024
Link: https://doi.org/10.1587/..
 
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2

Influence of Au finish thickness on air tightness of SiP RF..:

, In: 2022 International Conference on Microwave and Millimeter Wave Technology (ICMMT),
Wang, Cheng ; Sun, Huhao ; Xie, Lu - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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3

Study of large area substrate assembly process for T/R modu..:

, In: 2022 International Conference on Microwave and Millimeter Wave Technology (ICMMT),
Wang, Cheng ; Xie, Lu ; Chen, Cheng. - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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4

Interfacial Microstructure and Mechanical Reliability of Sn..:

Chen, Cheng ; Wang, Cheng ; Sun, Huhao...
Processes.  10 (2022)  2 - p. 295 , 2022
Link: https://doi.org/10.3390/..
 
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5

A multi-stage temperature gradient assembly process for mut..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Chen, Cheng ; Xie, Lu ; Sun, Huhao - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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6

Comparative study between the Sn–Ag–Cu/ENIG and Sn–Ag–Cu/EN..:

Tian, Ruyu ; Tian, Yanhong ; Huang, Yilong...
Journal of Materials Science: Materials in Electronics.  32 (2021)  6 - p. 6890-6899 , 2021
Link: https://doi.org/10.1007/..
 
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7

Interfacial Microstructure and Mechanical Reliability of Sn..:

Cheng Chen ; Cheng Wang ; Huhao Sun...
https://www.mdpi.com/2227-9717/10/2/295.  , 2022
Link: https://doi.org/10.3390/..
 
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8

Interfacial Microstructure and Mechanical Reliability of Sn..:

Cheng Chen ; Cheng Wang ; Huhao Sun...
Chemical Processes and Systems.  , 2022
Link: https://doi.org/10.3390/..
 
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