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2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
2
Sintering Mechanism Analysis of Cu Nanoparticles via Molecu..:
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2023 24th International Conference on Electronic Packaging Technology (ICEPT) ,
3
Quantitative analysis of the interface strength of ultra-th..:
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Pattern Recognition and Computer Vision; Lecture Notes in Computer Science ,
6