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Proceedings of 2005 IEEE/LEOS Workshop on Fibres and Optical Passive Components, 2005. ,
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Packaging of filter-integrated hybrid transceiver for subsc..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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System Level Analysis and Design Optimization of Back-side ..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Effective Interface Simulation Approach Based on Peak Disto..:
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2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) ,
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Power Integrity Design of Mobile 3D-IC Based on the Allocat..:
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2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) ,
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Design and Analysis of Double-side Characteristic Impedance..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Statistical Analysis of Off-chip Power-Integrity for Multic..:
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2023 IEEE 27th Workshop on Signal and Power Integrity (SPI) ,
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Advanced Phase Jitter Analysis with Power Noise Induced Jit..:
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2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) ,
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Experimental Method for Measuring the Jitter Sensitivity Fu..:
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2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) ,
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PI Design for 3DIC implementaion:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Optimal Channel Design for Die-to-Die Interface in Multi-di..:
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2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) ,
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Simplified Analysis for Silicon Capacitors:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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PSI Design Solutions for High Speed Die-to-Die Interface in..:
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2022 IEEE 26th Workshop on Signal and Power Integrity (SPI) ,
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