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Sungwook Moon
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1

Packaging of filter-integrated hybrid transceiver for subsc..:

, In: Proceedings of 2005 IEEE/LEOS Workshop on Fibres and Optical Passive Components, 2005.,
Sungwook Moon ; Rogovsky, G. ; Sub Han... - p. 299,300,301,302 , 2005
Link: https://doi.org/10.1109/..
 
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2

System Level Analysis and Design Optimization of Back-side ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Song, Kyunghwan ; Moon, Sungwook ; Kang, Minseok... - p. 903-907 , 2024
Link: https://doi.org/10.1109/..
 
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3

Effective Interface Simulation Approach Based on Peak Disto..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Kim, Joonhyun ; Nam, Seungki ; Moon, Sungwook... - p. 1104-1107 , 2024
Link: https://doi.org/10.1109/..
 
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4

Power Integrity Design of Mobile 3D-IC Based on the Allocat..:

, In: 2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS),
Kim, Hyunwoong ; Lee, Seonghi ; Park, Dongryul... - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
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5

FPC Design Guidelines for Enabling High-Speed Intrapanel In..:

Kim, Jinho ; Moon, Sungwook ; Lee, Jihyun.
IEEE Letters on Electromagnetic Compatibility Practice and Applications.  5 (2023)  3 - p. 97-101 , 2023
Link: https://doi.org/10.1109/..
 
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6

Design and Analysis of Double-side Characteristic Impedance..:

, In: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI),
Lee, Seonghi ; Kim, Hyunwoong ; Park, Jiyoung... - p. 147-152 , 2023
Link: https://doi.org/10.1109/..
 
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7

Statistical Analysis of Off-chip Power-Integrity for Multic..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Han, Sodam ; Moon, Sungwook ; Son, Jungil. - p. 991-995 , 2023
Link: https://doi.org/10.1109/..
 
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8

Advanced Phase Jitter Analysis with Power Noise Induced Jit..:

, In: 2023 IEEE 27th Workshop on Signal and Power Integrity (SPI),
Choi, Jonguk ; Park, Taeho ; Ryu, Jongjae... - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
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9

Experimental Method for Measuring the Jitter Sensitivity Fu..:

, In: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI),
Kim, Joonhyun ; Lee, Seonha ; Nam, Seungki.. - p. 668-668 , 2023
Link: https://doi.org/10.1109/..
 
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10

PI Design for 3DIC implementaion:

, In: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI),
Moon, Sungwook ; Kang, Minsuk ; Ahn, Duhyoung. - p. 669-669 , 2023
Link: https://doi.org/10.1109/..
 
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11

Optimal Channel Design for Die-to-Die Interface in Multi-di..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Park, Jiyoung ; Nam, Seungki ; Moon, Sungwook. - p. 1509-1513 , 2023
Link: https://doi.org/10.1109/..
 
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12

Simplified Analysis for Silicon Capacitors:

, In: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI),
Son, Jungil ; Ku, Kunwoo ; Nam, Seungki.. - p. 682-682 , 2023
Link: https://doi.org/10.1109/..
 
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13

PSI Design Solutions for High Speed Die-to-Die Interface in..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Kim, Taeyun ; Moon, Sungwook ; Jo, Chanmin.. - p. 2158-2162 , 2022
Link: https://doi.org/10.1109/..
 
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14

Random Jitter Analysis and Measurement for Reference Clock ..:

, In: 2022 IEEE 26th Workshop on Signal and Power Integrity (SPI),
Choi, Jonguk ; Kim, Dongchul ; Ryu, JongJae... - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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15

Sung-Wook Moon, Rutebeuf ou une écriture du « divers »: Thè..:

Moon, Sung-Wook
Perspectives médiévales.  , 2022
Link: https://doi.org/10.4000/..
 
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