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Sur, Jianjun
1
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Accurate 3DIC thermal simulation for BEOL influence study:
, In:
2022 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)
,
Yang, Hao
;
Yan, Bin
;
Sur, Jianjun
... - p. 17-19 , 2022
Link:
https://doi.org/10.1109/..
1-1
