Swinnen, Bart
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5

Stress Analysis on Ultra Thin Ground Wafers:

Teixeira, Ricardo C. ; De Munck, Koen ; De Moor, Piet...
Journal of Integrated Circuits and Systems.  3 (2020)  2 - p. 83-89 , 2020
 
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6

Predictive value of JC virus PCR in cerebrospinal fluid in ..:

Swinnen, Bart ; Saegeman, Veroniek ; Beuselinck, Kurt...
Diagnostic Microbiology and Infectious Disease.  95 (2019)  3 - p. 114859 , 2019
 
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12

Reliability concerns in copper TSV's: Methods and results:

, In: 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits,
 
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14

Detection of failure sites by focused ion beam and nano-pro..:

Yang, Yu ; Bender, Hugo ; Arstila, Kai...
Microelectronics Reliability.  48 (2008)  8-9 - p. 1517-1520 , 2008
 
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15

Process induced sub-surface damage in mechanically ground s..:

Yang, Yu ; De Munck, Koen ; Teixeira, Ricardo Cotrin...
Semiconductor Science and Technology.  23 (2008)  7 - p. 075038 , 2008
 
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