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2024 International Conference on Electronics Packaging (ICEP) ,
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Solder Joint Lifetime Characterization of a SiC Power MOSFE..:
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2023 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia) ,
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The Development of 1.7kV 100A SiC MOSFET Power Module for A..:
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2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
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