Syu, Ji-Yuan
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1

Power Cycling Modeling and Lifetime Evaluation of SiC Power..:

Cheng, Hsien-Chie ; Syu, Ji-Yuan ; Wang, He-Hong...
IEEE Transactions on Device and Materials Reliability.  24 (2024)  1 - p. 142-153 , 2024
 
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2

Comprehensive Influences of Manufacturing Process Integrate..:

Lee, Chang-Chun ; Wang, Chi-Wei ; Syu, Ji-Yuan.
IEEE Transactions on Components, Packaging and Manufacturing Technology.  14 (2024)  5 - p. 824-831 , 2024
 
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3

Solder Joint Lifetime Characterization of a SiC Power MOSFE..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
 
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4

The Development of 1.7kV 100A SiC MOSFET Power Module for A..:

, In: 2023 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia),
 
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5

Thermal Design of SiC Power Module for EV/HEV Applications:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
 
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6

Reliability evaluation of ultra thin 3D-IC package under th..:

Lee, Chang-Chun ; Lin, Yu-Min ; Liu, Hou-Chun...
Microelectronic Engineering.  244-246 (2021)  - p. 111572 , 2021
 
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14

A study on mechanical behavior of Kevlar fiber reinforced c..:

Li, Yeou-Fong ; Huang, Yan-Ru ; Syu, Jin-Yuan..
International Journal of Protective Structures.  14 (2022)  3 - p. 407-437 , 2022
 
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