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Tai, Chai
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1

ED‐1 is a marker for activated macrophages and subclinical ..:

Brown, Russell ; Lefebvre, Daniel ; Tai, Chai...
The FASEB Journal.  23 (2009)  S1 - p. , 2009
Link: https://doi.org/10.1096/..
 
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2

77GHz Cavity-Backed AiP Array in FOWLP Technology:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Mei, Sun ; Guan, Lim Teck ; Tai Chong, Chai - p. 82-86 , 2022
Link: https://doi.org/10.1109/..
 
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3

Reliability of Wire Bonding on Low-k Dielectric Material in..:

Sivakumar, Mohandass ; Kripesh, Vaidyanathan ; Ser Choong, Chong..
Microelectronics Reliability.  42 (2002)  9-11 - p. 1535-1540 , 2002
Link: https://doi.org/10.1016/..
 
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4

Vertical Stacking of Heterogeneous Chiplets of Duplexer on ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Chong, Chai Tai ; Rotaru, Mihai ; Xiangyu, Wang... - p. 2017-2023 , 2024
Link: https://doi.org/10.1109/..
 
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5

77-GHz FOWLP MIMO AiP for Compact High-Resolution Radar Wit..:

Sun, Mei ; Guan Lim, Teck ; Soon Wee Ho, David...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  14 (2024)  4 - p. 537-546 , 2024
Link: https://doi.org/10.1109/..
 
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6

3D Stacking of Heterogeneous Chiplets on Modified FOWLP Pla..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Chong, Chai Tai ; Long, Lau Boon ; Siang, Sharon Lim Pei... - p. 24-28 , 2023
Link: https://doi.org/10.1109/..
 
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7

Design and Analysis of 3D Heterogeneous Chiplet Stack for R..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Rotaru, Mihai Dragos ; Tiwari, Shashank ; Castillou, Paul.. - p. 1486-1492 , 2023
Link: https://doi.org/10.1109/..
 
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8

Process and Integration Challenges for Via Last TSV (from t..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Wang, Xiangyu ; Rotaru, Mihai Dragos ; Haitao, Yu... - p. 116-119 , 2023
Link: https://doi.org/10.1109/..
 
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9

Board level FEA reliability and stress modeling for chip-to..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Mandal, Rathin ; Chong, Chai Tai - p. 1735-1738 , 2023
Link: https://doi.org/10.1109/..
 
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10

Assembly process characterization of 3D Stacking of Heterog..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Siang Lim, Sharon Pei ; Long Lau, Boon ; Chai, Tai Chong. - p. 24-28 , 2023
Link: https://doi.org/10.1109/..
 
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11

Assembly challenges and demonstrations of ultra-large Anten..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Lim, Sharon Pei Siang ; Chong, Ser Choong ; Wee, David Ho Soon. - p. 635-642 , 2022
Link: https://doi.org/10.1109/..
 
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12

Via-Last TSV (From Top) Fabrication on a LNA SOI Wafer for ..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Wang, Xiangyu ; Rotaru, Mihai Dragos ; Haitao, Yu.. - p. 119-123 , 2022
Link: https://doi.org/10.1109/..
 
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13

Wafer Warpage Optimization Via Finite Element Analysis for ..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Ji, Lin ; Chai, Tai Chong ; Siang Lim, Sharon Pei - p. 707-711 , 2022
Link: https://doi.org/10.1109/..
 
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14

Development of Two-Tier FO-WLP AiPs for Automotive Radar Ap..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Ho, Soon Wee ; Hsiang-Yao, Hsiao ; Long, Lau Boon... - p. 1376-1383 , 2022
Link: https://doi.org/10.1109/..
 
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15

Heterogeneous Integration for Chiplets on FOWLP Development..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Chong, Chai Tai ; Ho, Soon Wee ; Choong, Chong Ser.. - p. 655-659 , 2022
Link: https://doi.org/10.1109/..
 
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