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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Development of Glass core substrate with the stress analysi..:
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2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
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High Speed Transmission Characteristics on Glass Based Inte..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Panel-Based Large-Scale RDL Interposer Fabricated Using 2-μ..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
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