Tan, A.L.
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2

A CMP Process for Hybrid Bonding Application with Conventio..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Widodo, T. S. ; Brun, X. F. ; Lianto, P.... - p. 2058-2061 , 2024
 
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Investigation of Power-Down Leakage Bin Fallout Caused by F..:

, In: 2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Tang, Jialiang ; ISLAM, Mohd Nurul ; Tan. - p. 1-4 , 2024
 
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Creep-induced redistribution of alloying elements in CZ1 zi..:

Lin, W.T. ; Lv, Q.Y. ; Jiao, D....
Journal of Materials Science & Technology.  173 (2024)  - p. 31-44 , 2024
 
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Theoretical study of susceptibility and effective mass in s..:

Van Tan, Le ; Muoi, Do
Physica B: Condensed Matter.  677 (2024)  - p. 415702 , 2024
 
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Multi-objective optimization of plant community characteris..:

Yu, Miao ; Song, Shuqing ; Jiang, Chuling...
Urban Forestry & Urban Greening.  98 (2024)  - p. 128397 , 2024
 
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